Definition and Classification of PCB

Type

Illusion

Characteristics

Main Applications     

Single side board

Conductive patterns are formed only on one side of the insulating substrate.

Used in household appliances, electronic remote controllers, and simple electronic products.

Double-side board

Double-sided structure with conductive patterns on both top and bottom layers, typically connected by plated through-holes (PTH).

Used in consumer electronics, computers, automotive electronics, communication equipment, and industrial control systems.

Multilayer board

Four or more layers, formed by laminating multiple single- or double-sided boards together.

Used in consumer electronics, communication equipment, industrial control, automotive electronics, military, and aerospace applications.

HDI board

Characterized by high density, fine traces, and microvias.

Used in smartphones, tablets, digital cameras, and wearable devices.

Flexible board

Made from flexible insulating substrates; lightweight, thin, and bendable.

Used in smartphones, tablets, and wearable devices.

Package Substrate

Directly used for chip mounting, providing packaging, electrical connection, protection, and heat dissipation.

Used for chip packaging in various electronic devices.