Explanation of PCB-related terms:

PCB (Printed Circuit Board): A printed circuit board refers to a board with conductive patterns and printed components formed according to a predetermined design on a general substrate. Its primary functions are: 1) To provide mechanical support for various components in the circuit; 2) To establish electrical connections between various electronic components, serving as a medium for signal transmission; 3) To mark the location of each component with identifiers, facilitating assembly, inspection, and debugging.

CCL (Copper Clad Laminate): CCL is the core material used to manufacture PCBs, serving three major functions: electrical conductivity, insulation, and mechanical support. The quality of CCL determines the performance, quality, manufacturability, production level, cost, and long-term reliability of the PCB.

FR-4: A type of flame-retardant epoxy resin-based copper clad laminate reinforced with glass fiber cloth.

HDI (High Density Interconnect): A type of high-density PCB technology characterized by fine lines, microvias, and thin dielectric layers, allowing for high-density circuit interconnections.

Rigid Board: A type of PCB made from rigid base materials that are inflexible and possess certain toughness and strength.

Flexible Printed Circuit (FPC): Also known as flex circuits, these are PCBs made from flexible insulating substrates such as polyimide or polyester films. FPCs can be bent, folded, and shaped according to spatial layout requirements, enabling movement and expansion in three-dimensional space and allowing for integration of component assembly and wiring.

Multilayer Board: A PCB with four or more layers, formed by laminating multiple single-sided or double-sided boards together. Conductive pathways between layers are created through sequential drilling and metallization processes.

IC Package Substrate: Also known as IC packaging substrate or carrier board, it is a key carrier used in the packaging and testing stage of the semiconductor industry. It supports multi-pin connections, reduces package size, improves electrical performance, and enables high-density integration.

SLP (Substrate-Like PCB): A next-generation PCB technology, SLP offers finer line width and spacing (down to 20/35 microns compared to HDI’s 40/50 microns). From a manufacturing process perspective, SLP is closer to IC substrates used in semiconductor packaging but does not yet meet the full specifications of IC substrates. As it is still used for mounting passive and active components, it is classified under the PCB category. An SLP can accommodate twice as many components as an HDI board within the same area.