PCB Market Trends and Forecast Through 2026 Ⅳ

HDI (High Density Interconnect) boards are characterized by their lightweight, thin, short, and compact design. These features enable higher circuit density, facilitate the use of advanced packaging technologies, and significantly enhance signal transmission quality. As a result, the functionality and performance of electronic devices can be greatly improved, while also contributing to smaller and more portable product designs. For high-end communication devices, HDI technology supports enhanced signal integrity, facilitates stringent impedance control, and ultimately improves overall product performance.
In 2017, the global HDI board market was valued at USD 8.178 billion. By 2021, it had grown to approximately USD 10.647 billion, representing a CAGR of 6.82% from 2017 to 2021. It is projected to reach USD 15.061 billion by 2026, with a CAGR of around 7.18% from 2021 to 2026. Due to the high technical requirements, leading HDI board manufacturers in Mainland China have seen steady growth in revenue, with gross margins remaining at a relatively high level.